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AMD's first quad-core K8L desktop processor, the Altair, originally set to utilize the Socket AM3 connector, will be resident in Socket AM2+. Socket AM2+ adopts HyperTransport 3.0. Socket AM3 CPUs can only be compatible with Socket AM2- and Socket AM3-based motherboards, but Socket AM3-based motherboards cannot support any previous-generation processors. AMD has decided to postpone the adoption of DDR3 until the middle of 2008, when its first Socket AM3 processor manufactured on 45nm process technology will be announced. Shipments of AMD's Socket AM2+ CPUs, which will appear in the third quarter of next year, are expected to account for 15% of the chip vendor's desktop processors by the end of 2007. According to HKEPC, Altair would be clocked somewhere between 2.7-2.9GHz at 125W TDP, with 512KB L2 Cache for each core such that 2MB L2 Cache in total, and shared 2M L3 Cache.

Source: DigiTimes

OCZ announced the Mega-Kart, a ultra-high capacity USB flash drive. With 8GBs of memory, the OCZ Mega-Kart series is the ultimate data storage solution for today’s computer enthusiasts and business professionals on the go. The beauty of the new Mega-Kart series is the unparalleled, ultra-slim architecture that is thin enough to carry in a wallet. The OCZ Mega-Kart Flash Drive series will be initially available in 8GB, and larger capacities will follow shortly.

Source: OCZ

PowerColor X1650 PRO comes with 600MHz core, running 1400MHz of 256MB 128-bit DDR3 memory; a killer in the mainstream segment. It supports anti-aliasing with HDR Support for DirectX 9.0c, Open GL 2.0, Shader Model 3.0 dual graphic card solution with CrossFire.

There appears to be 2 types of cooling employed; air or hybrid water/air cooling but both took up 2 slots. There are 2 power connectors on the card and has 1GB of GDDR4 memories onboard. We have heard that the hybrid water/air cooler might not be available this time round but slated for later stage.

AMD announced the opening of an advanced microprocessor development facility in Fort Collins, CO. Dubbed the “Mile High Design Center” (MHDC), the facility is the latest in AMD’s growing international network of chip design hubs. AMD plans to use the increased flexibility and efficiency provided by the MHDC to accelerate the introduction of next-generation microprocessors that are more closely aligned with the evolving priorities of customers, partners and end users worldwide. AMD also operates microprocessor design centers in Sunnyvale, CA; Austin, TX; Boxborough, MA; Bangalore, India; and Dresden, Germany.

ASUS announce the self-developed Cross Graphics Impeller (C.G.I.) technology, which provides a significant performance increase over competing Intel P965/ATI CrossFire motherboards without this advanced innovation. C.G.I is now available on the ASUS P5B Deluxe and P5B Deluxe/WiFi-AP motherboards. CrossFire performance optimization offered by C.G.I occurs in Direct Media Interface (DMI) between the P965 Northbridge, which carries one x16 PCI Express slot (x16 PCI Express Lanes) , and ICH8R Southbridge, where another x16 PCI Express slot (x4 PCI Express Lanes) resides. C.G.I streamlines data transfer between the Northbridge and Southbridge, delivering enhanced performance during Crossfire dual-GPU mode. Users of the two ASUS motherboards can upgrade to C.G.I by dowlonding the latest BIOS on the ASUS support website.

Intel plans to launch its 2nd generation quad-core processors - the Yorkfield series–as replacement parts for the upcoming Core 2 Quad (codenamed Kentsfield) CPUs in the third quarter of 2007. Yorkfield will have one L2 cache shared directly by each pair of chips, enabling more efficient quad-core operation, with less FSB bandwidth. Yorkfield will be paired with the next-generation Bearlake chipset family, which will support a 1333MHz FSB and a PCI Express 2.0 interface. The first Yorkfield-based systems, which will utilize the Bearlake X chipset and DDR3-1333 memory, will target the high-end gaming market.

Intel plans to add more than 50 new streaming SIMD extensions (SSE4) to extend the Intel 64 instruction set architecture for the 45-nanometer node. The new instructions are scheduled to debut in the "Penryn" generation of processors, due to start arriving in 2008 and built using a manufacturing process with 45-nanometer feature. Intel chose to introduce earlier disclosure to help software companies that must adapt their programs to take advantage of the extensions. Microsoft and Adobe Systems both are working with Intel already to support the instructions.

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